Title: DETD Graduate Engineering Intern (PF BE)
Location: USA-Arizona, Phoenix
Job Number: 703809
This position will be working in the substrate Pathfinding team. Responsibility includes alternative bumping technology and FLI (first level interconnect) architecture pathfinding; fundamental study on solder metallurgy and the impact of solder joint mechanical properties and microstructure on FLI and SLI (second level interconnect) reliability;The successful candidate will work in highly technical environment interfacing and collaborating with multiple groups within packaging design, material development, process integration, equipment engineering, manufacturing and fabrication factories.
Qualifications:
Candidate must be enrolled in a graduate engineering program pursuing a M.S./Ph.D. in Materials Science, Chemical Engineering, or Mechanical Engineering.
Additional qualifications include:
- Demonstrate experience in analytical tools (such as SEM, EDX, EBSD and mechanical testing)
- Demonstrate experience in fundamentals of material science and engineering
- Demonstrate experience in solder metallurgy, phase diagrams, material deformation, and material modification & development
- Experience in packaging FLI (First Level Interconnect)/SLI (Second Level Interconnect) related industry preferred
- Strong engineering troubleshooting and analytical skills
- Good team participation skills
- Strong communication and teamwork skills
- Demonstrated verbal and written communication skills
- Comfortable presenting issues and solutions to multiple layers of management
- Should have 3.3 GPA or higher
- Should have at least one semester following internship prior to graduation
Job Category: Engineering
Full/Part Time: Full Time
Job Type: Student/Intern
