Title: Process TD Engineer
Location: USA-Arizona, Phoenix
Job Number: 703709

We are seeking for a highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for Module Engineering. In this position, you will be developing process and equipment for Intel Assembly to meet quality, reliability, cost, yield, productivity and manufacturability requirements and working in a highly matrixed environment interfacing with multiple development groups including Packaging Design, Manufacturing, Materials Development, Silicon Integration, Platform Integration, Equipment Development, and High Volume Manufacturing (HVM) factories.

Job Description: Plans and conducts experiments to fully characterize the process throughout the development cycle (pathfinding, discovery, definition, and development, and high volume manufacturing ramp). Drives improvements on quality, reliability, cost, yield, process stability and/or capability, productivity and safety and/or ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production and/or receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory startup as well as install and qualification of the new production lines.

Qualifications:

Minimum Qualifications
You must possess the minimum qualifications to be initially considered for this position. Experience would be obtained through your educational level research and/or relevant job/internship experiences.

Bachelor's or Master's degree in Materials Science, Chemical or Mechanical Engineering or any electronic packaging related field.

Additional qualifications include:

• Demonstrate knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles


• Demonstrate experience of equipment skills and capable of driving improvements in equipment needed to deliver leading edge process capability

Preferred Skills:

• Demonstrate experience and knowledge in semiconductor packaging process would be an added advantage

Job Category: Engineering
Full/Part Time: Full Time
Job Type: College Graduate